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Double Side Mask Aligner "EVG 620"

  • contact lithography
  • lamp: 350 W Hg
  • optics: broadband 350-450 nm wavelength
    or filter i-line (365 nm)
  • sampe size: 2"-100 mm wafer (maximum exposure size 3"), pieces
  • mask size: 4"-125 mm
  • front and back side alignment
  • contact modes: proximity, soft, hard, vacuum, hard+vacuum
  • alignment for substrate bonding