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Sputtering system "Oerlikon UNIVEX 450 C"

  • 4 inch sputter targets
  • 2 process chambers equipped with 6 magnetrons each
  • materials: Ag, Au, Cu, Cr, Ti, SiO2, Co, Fe, permalloy, IrMn, Ru, MgO; further materials on request
  • concurrent operation of two targets per process chamber
  • oscillation of the substrate beneath a single target or between two targets in one process  chamber
  • optional: pretreatment of the substrates via sputter-etching
  • optional: sample heating up to 500 °C
  • optional: substrate bias