RPTU
Nano Structuring Center
English
Deutsch
Nano Structuring Center
Staff
Equipment
Equipment
Equipment
Dualbeam system FIB/SEM
FEI Helios Nanolab 650
Electron Beam Lithography
Photolithography
Mask Aligner
Spray Coater
Spin Coater
HMDS Oven
Processing
Electron Beam Evaporator
Sputter Deposition
Plasma Etching
Ion Beam Etching
Dicing Saw
Oxidation Furnace
Plasma Asher
Substrate Bonder
Wire Bonder
Convection Oven
Vacuum Oven
High Vacuum Coater
Sample Surface Cleaning System
Cross section polisher
Analytics
Stylus Profilometer
Spectroscopic Ellipsometer
Four Point Probe Station
Microspectrometer
Optical Microscopes
Energy-dispersive X-ray Spectroscopy (EDX)
Scanning Electron Microscope
Atromic force microscope
Publications
Publications
Publications
2020
2019
2018
2017
2016
2015
2014
2013
2012
2011
2006-2010
Address
Links
Nano Structuring Center
NSC
Equipment
Processing
Dicing Saw
Dicing saw "Disco DAD321"
Substrate size: max. 150 mm diameter
xy-accuracy: 5 µm
cut depth accuracy: 1 µm
