Sputtering system "Oerlikon UNIVEX 450 C"
- 4 inch sputter targets
- 2 process chambers equipped with 6 magnetrons each
- materials: Ag, Au, Cu, Cr, Ti, SiO2, Co, Fe, permalloy, IrMn, Ru, MgO; further materials on request
- concurrent operation of two targets per process chamber
- oscillation of the substrate beneath a single target or between two targets in one process chamber
- optional: pretreatment of the substrates via sputter-etching
- optional: sample heating up to 500 °C
- optional: substrate bias