Double Side Mask Aligner "EVG 620"
- contact lithography
- lamp: 350 W Hg
- optics: broadband 350-450 nm wavelength
or filter i-line (365 nm) - sampe size: 2"-100 mm wafer (maximum exposure size 3"), pieces
- mask size: 4"-125 mm
- front and back side alignment
- contact modes: proximity, soft, hard, vacuum, hard+vacuum
- alignment for substrate bonding